

WE SOLVE HARD PROBLEMS
WITH NANOTECHNOLOGY
Applied Nanotech scientists and engineers work to create innovations and develop new products that meet your business needs.
HARNESS THE POWER OF NANOTECHNOLOGY FOR YOUR BUSINESS
Applied Nanotech, Inc. (ANI) is a Nano Magic Inc. Company. ANI operates independently and serves as Nano Magic’s Technology and Innovation Center.
50+
30+
2009
2010
2019
Al
Aluminum Ink + Paste
- Formulated for non-contact printing
- Ideal for spray and aerosolized jet printing
- Designed for silicon water-based photovoltaic applications
- Low contact resistivity on silicon
- Forms highly uniform back surface field (BSF) layer
- Lead and cadmium free
Ag
Silver Ink + Paste
- Suitable for drop on demand printing
- Prints highly conductive lines and patterns
- Used in the printed electronics industry
- Ag-IJ10 ink can be thermally sintered at low temperatures on PET and special papers
Cu
Copper Ink + Paste
- For use in printing highly conductive lines and patterns
- Low-cost alternative to silver and gold-based inks
- Rapid cure at room temperature using photosintering
- Easy to integrate into high-volume production lines
- Formulations for various printing platforms, including ink jet, aerosol jet and screen printing
Ni
Nickel Ink + Paste
- For the printed electronics and solar industry
- Can be printed and sintered on silicon any polyamide
- Formulations for various printing platforms, including ink jet, aerosol jet and screen printing
- Available as ink or paste
CuNi
Copper Nickel Alloy Ink
- For use printing lines and patterns for printed resistors, strain gauges, thermopiles, and thermocouple applications
- Optimized for aerosol jet printing
- Can be printed and cured to form conductive patterns on silicon, ceramics, and Kapton
- Alloy particle size ranges from 20-40nm
- Available as ink or paste
Al
Aluminum Ink + Paste
- Formulated for non-contact printing
- Ideal for spray and aerosolized jet printing
- Designed for silicon water-based photovoltaic applications
- Low contact resistivity on silicon
- Forms highly uniform back surface field (BSF) layer
- Lead and cadmium free
Ag
Silver Ink + Paste
- Suitable for drop on demand printing
- Prints highly conductive lines and patterns
- Used in the printed electronics industry
- Ag-IJ10 ink can be thermally sintered at low temperatures on PET and special papers
Cu
Copper Ink + Paste
- For use in printing highly conductive lines and patterns
- Low-cost alternative to silver and gold-based inks
- Rapid cure at room temperature using photosintering
- Easy to integrate into high-volume production lines
- Formulations for various printing platforms, including ink jet, aerosol jet and screen printing
Ni
Nickel Ink + Paste
- For the printed electronics and solar industry
- Can be printed and sintered on silicon any polyamide
- Formulations for various printing platforms, including ink jet, aerosol jet and screen printing
- Available as ink or paste
CuNi
Copper Nickel Alloy Ink
- For use printing lines and patterns for printed resistors, strain gauges, thermopiles, and thermocouple applications
- Optimized for aerosol jet printing
- Can be printed and cured to form conductive patterns on silicon, ceramics, and Kapton
- Alloy particle size ranges from 20-40nm
- Available as ink or paste
RESEARCH SERVICES
Edge out your competition with the small details that add up. We offer a total solution by providing not only the ink and paste materials, but also R&D prototyping services. We can inkjet and screen print our ink and paste materials on a variety of substrates for many applications. We provide thermal and photo-sintering capabilities.
Please use the contact form to reach out about your early-stage development needs.